Notes

So I while working for Fujistu-Siemens , i was exposed to working on Camline for their Mainboard and SMD production lines in Augsburg. Later to Siemens SImatic for the automotive manufacturing plant which was Siemens VDO

Collaboration with meyer Berger group, Berger Lichttechnik group, Beckhoff, Siemens etc..

-- Figure out whats the availabilty of MES - availability reporting for last 12m, Downtime (time to repair or service down time ?) , Incident detection time, incident repair time, incident root cause analysis..

-- Non stop production - How --> 1. data caching (label printing, agent caching), 2.smart clients, 3. Horizontal communication btw equipments

http://literature.rockwellautomation.com/idc/groups/literature/documents/ap/oem-ap059_-en-p.pdf

Virtualization -- Read this --> http://www.ab.com/onecontact/process/whitepaper/get/PROCES-WP007A-EN-P.pdf

Business Assessment - Here a process centric approach is required to assess if some standardization of process is required across all enterprises. Here we try to establish the possible opportunities that exists within a organization where improvements can be made in the existing system

Business case development - Once the opportunities for improvement exists , i set the priorities and make a business case for implmenting a staged integration. This priorotization is ofcourse different for different companies
Implementation planning
Execution

1. (Surface Mount device )SMD Assembly Line - for mainboards for servers and different electronics components

1st Screening machine machine which has stencil in it which is carved on the bare PCB board.sorter paste is applied with sorter paste printer
2nd Vision system to detect any errors
3rd Pick and place machine or Assembly Machine [Lowerside of PCB]- where each compnents are put on the board automatically- these components are resistors, diodes, or integrated circuits
4th Reflow soldering [ lower side of PCB]
5th pick and place machine [ Upper side of PCB]
again a pick and place machine
6th inspection (automatic optical inspection)
7th reflowSoldering oven - each board having its own individual thermal profile
8th Automated visual inspection - camera checks for missing components with a Master Image and checks if the board is assembled correctly or not.
9. Automated THT(Through Hole Technology) assembly - larger components like capacitors and coils are assembled by hand using through hole technology
10. wave soldering under nitrogen env.
11. Optical inspection
12.Electrical test
230000 components per hour - with this speed we produce circuit board every 30 secs



-- Is ZNT into Process manufacturing as well ?